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Biodetioration and strength reductions in preservative treated aspen waferboard
1983 - IRG/WP 2195
Experimental aspen waferboards, bonded with liquid or powdered phenol formaldehyde resins and treated by various methods with a wide selection of preservatives, were tested for fungal resistance in accelerated laboratory trials. Mold growth on the surface as well as weight and strength losses due to the actions of decay fungi were determined. Testing of board strength after decay in high and moder...
E L Schmidt, H J Hall, R O Gertjejansen, R C De Groot