Dimensional stability and decay resistance of hot-melt self-bonded particleboard by surface benzylated pine chips
M Kiguchi, K Yamamoto
Akamatsu (Pinus densiflora Sieb. et Zucc: Japanese red pine) particles were pretreated with 40% NaOH solution and benzylated with benzyl chloride, and the surface of particle was converted into meltable materials. Hot-melt self bonded particleboard having smooth and high glossiness surface was prepared by hot pressing at 150°C and 1.96 MPa without using any conventional adhesives. Dimensional stability and decay resistance of the benzylated particleboard were evaluated. Particleboards made of benzylated particles having more than 38% of weight percent gain (WPG) showed that dimensional stability and decay resistance were superior to the conventional particleboard made by using phenolformaldehyde resin as a binder, because hydroxyl groups of wood were substituted by hydrophobic benzyl groups with benzylation. Though bending strength of the board was a little lower than control board due to the damage of benzylated particles during benzylation, its internal bonding strength was very high, because the hot-melting strengthened the inter-particle bonding.