Dimensional stability and decay resistance of hot-melt self-bonded particleboard by surface benzylated pine chips

IRG/WP 3652

M Kiguchi, K Yamamoto

Akamatsu (Pinus densiflora Sieb. et Zucc: Japanese red pine) particles were pretreated with 40% NaOH solution and benzylated with benzyl chloride, and the surface of particle was converted into meltable materials. Hot-melt self bonded particleboard having smooth and high glossiness surface was prepared by hot pressing at 150°C and 1.96 MPa without using any conventional adhesives. Dimensional stability and decay resistance of the benzylated particleboard were evaluated. Particleboards made of benzylated particles having more than 38% of weight percent gain (WPG) showed that dimensional stability and decay resistance were superior to the conventional particleboard made by using phenolformaldehyde resin as a binder, because hydroxyl groups of wood were substituted by hydrophobic benzyl groups with benzylation. Though bending strength of the board was a little lower than control board due to the damage of benzylated particles during benzylation, its internal bonding strength was very high, because the hot-melting strengthened the inter-particle bonding.


Keywords: BENZYLATION; CHIPS; DECAY RESISTANCE; DIMENSIONAL STABILITY; PARTICLEBOARDS; PINUS DENSIFLORA; SEM; SG; THERMOPLASTICIZATION

Conference: 91-05-20/24 Kyoto, Japan


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