Aspen wafers were sequentially treated under vacuum with formaldehyde and sulfur dioxide gas and pressed into waferboard bonded with powdered phenol formaldehyde resin. Decay resistance and strength properties were determined before and after simulated weathering. The water resistance of the phenol bonding system was lost in board made from the gas-treated wafers. This white rot fungus Coriolus versicolor was unable to decay treated waferboard in a soil block test, but the brown rot fungi Gloeophyllum trabeum and Poria placenta decayed the samples as severely as untreated controls.

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