Biodetioration and strength reductions in preservative treated aspen waferboard
E L Schmidt, H J Hall, R O Gertjejansen, R C De Groot
Experimental aspen waferboards, bonded with liquid or powdered phenol formaldehyde resins and treated by various methods with a wide selection of preservatives, were tested for fungal resistance in accelerated laboratory trials. Mold growth on the surface as well as weight and strength losses due to the actions of decay fungi were determined. Testing of board strength after decay in high and moderate-hazard exposure conditions required modification of decay tests used for solid wood. A range of protection was noted with no preservative system exceeding the efficacy of the inorganic salt formulations. Averaged over all treatments, strength loss and weight loss are well correlated. Field exposures of effective treatments are underway.