Chemically-modified low-density waferboards with cross-linking agents were produced using a fast-growing species of hardwood albizzia (Paraserienthes falcata Becker) as a raw materials and isocyanate resin as a glue adhesive. For the chemical modification, the vapor-phase formalization of the boards and the pad-dry-cure treatment of wafers with cross-linking agents were employed. The vapor-phase formalization was conducted for 5, 10 and 24 hours using tetraoxane as a source of formaldehyde, and the pad-dry-cure treatments with glutaraldehyde and ethyleneurea compound (DMDHEU) were made after impregnation of their 5 and 10% aqueous solutions of each chemical. Sulfur dioxide was used as a catalyst in both treatments. About 70% of antiswelling efficiency (ASE) was gained in all treated boards irrespective of reaction time or solution concentration. All treated boards were very stable to water soaking even in the 2-hour boiling on thickness swelling as well as linear expansion. Laboratory tests with brown-rot and white-rot fungi revealed that decay was completely suppressed in formaldehyde-treated boards, and small losses in weight were counted in other treated boards. All treated boards were also effective in resisting to the attack by the destructive termite Coptotermes formosanus.

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