Effect of thickened boron in preventing conidial germination of sapwood-inhabiting fungi
IRG/WP 94-30059
S C Croan
We evaluated the efficacy of thickened boron preservative "Diffusolä" in preventing conidia germination of sapwood-inhabiting fungi using plate bioassay, Southern Yellow Pine and sweetgum block tests, and green pine log sections. The test fungi were sapstain fungi Ceratocystis coerulescens, Ceratocystis minor, and Aureobasidum pullulans and mold fungi, Aspergillus niger, Penicillium spp, and Trichoderma spp. Conidial germination were inhibited in plate bioassay by Diffusol. Treatment of Southern Pine and sweetgum blocks and green pine log sections with a 10 percent boric acid equivalent of Diffusol inhibited conidial germination of sapstain and mold fungi. In the field exposure, the same Diffusol treatment of green pine log sections inhibited natural basidiospore and conidial germination of forest-inhabiting fungi, thus preventing wood discoloration and deterioration