The objective of this work was to demonstrate the utility of cornstarch-mimosa tannin-based resins designed for application as an adhesive in the particleboard production. Bond qualities of cornstarch-mimosa tannin- urea formaldehyde (UF) (10:4:86, weight ratios) resins and commercial UF resin were assessed by using an automatic bonding evaluation system, prior to production of particleboard panels. In order to evaluate the quality of cornstarch-mimosa tannin-UF (10:4:86, weight ratios) resins, particleboards were produced and physical and mechanical properties were investigated. These physical properties included rheological and solid phase 13C NMR analysis of resins. The biological performance of particleboard panels against both Coriolus versicolor and Coniophora puteana rots fungi were evaluated. Internal bond, surface soundness, modules of rupture and modulus of elasticity mechanical properties of particleboards bonded with cornstarch-mimosa tannin-UF (10:4:86, weight ratios) resins were also determined. The results showed that it is possible to add cornstarch and mimosa tannin respectively up to 10 % and 4 % to the UF resin without to alter the physical and mechanical properties of the boards. The performance of these panels is comparable to those of boards made using commercial UF resin. Biodegradation studies show that the presence of mimosa tannin in the adhesive improves the total resistance of the particleboards panels against both Coriolus versicolor and Coniophora puteana rot fungi.

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