This study sought to determine the effect of remediation with oxalic acid (OA) extraction and Bacillus licheniformis fermentation on the release of copper, chromium, and arsenic from particleboard made from remediated wood particles and also investigates durability of the particleboard against white and brown- rot fungi. Particleboard samples were manufactured using untreated, CCA-treated, OA-extracted, and bioremediated southern yellow pine particles. Results shows that oxalic acid extraction and bioremediation by B. licheniformis significantly increased removal of elements from CCA-treated wood particles. The particleboards containing OA-extracted and bioremediated particles showed generally high leaching losses of remaining elements. Exposure of particleboard samples to decay fungi indicated that Gloeophyllum trabeum caused greater weight losses in all samples than Postia placenta. In general, leached samples from all particleboard types had greater weight losses than unleached samples. CCA particleboard samples were the most resistant to fungal degradation.

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