Your search resulted in 3 documents.
Micronized Copper Preservative Systems: Observations on the Release of Cupric ion (Cu2+) from Treated Wood and Performance against Wood Decay Fungi
2009 - IRG/WP 09-30519
In an attempt to address the mechanism of action of micronized copper preservatives, a 20-week continuous water leaching study was conducted. The leaching results indicated that, once impregnated in wood, micronized copper preservatives continuously release cupric ion, and the levels of cupric ion released from micronized copper treated wood are higher than those released from CCA treated wood, a...
J Zhang, R Ziobro
Curing kinetics of nano cupric oxide (CuO) modified PF resin as wood adhesive: Effect of surfactant
2013 - IRG/WP 13-40620
The effect of nano cupric oxide (CuO) in combination with surfactants on the curing kinetics of phenol formaldehyde (PF) resin, as well as the bonding strength of plywood prepared using the modified resin were investigated in this study using dynamic and isothermal differential scanning calorimetry (DSC). The result showed that the incorporation of nano CuO along with alkane surfactant made in the...
Wei Gao, Guanben Du
Dynamic mechanical analysis (DMA) of nano cupric oxide (CuO) modified aqueous phenol formaldehyde (PF) resin
2014 - IRG/WP 14-40654
Phenol formaldehyde (PF) resins, modified by nano CuO incorporating alkane surfactant and polyvinyl alcohol (PVA) 17-99, were analyzed by dynamic mechanical analysis (DMA). The mechanical properties of its bonded plywood including tensile strength, modulus of rupture (MOR), modulus of elasticity (MOE) and shear strength under five test conditions were evaluated. Results indicated that the incorpor...
Wei Gao, Guanben Du