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Investigation of some technical properties of heat-treated wood
2003 - IRG/WP 03-40266
The objective of this study was to investigate some technical properties of heat-treated wood. Wood heat-treated according to a process intended for wood in above-ground end-uses (European hazard class 3) was subject to the following: · A delamination test according to EN 391 with glulam beams made of heat-treated pine (Pinus sylvestris) and spruce (Picea abies) laminations, assembled with PR...
C Bengtsson, J Jermer, A Clang, B Ek-Olausson


Cyclic delamination analysis of preservative-treated wood/FRP interfaces
2002 - IRG/WP 02-40244
Wood preservative chemicals can interfere with adhesive properties when bonding wood laminates or wood/FRP (Fiber Reinforced Polymer) laminate composites. In this work we studied the effects of various wood preservative treatments, and pre- and post-treatment on wood/wood and wood/FRP bond durability using a severe cyclic delamination test (ASTM D-2559). Pre-treatment of individual laminates with ...
C Tascioglu, B Goodell, R Lopez-Anido


The effect of oil-borne preservative treatments on the shear strength of FRP/wood composite adhesive bonds
2003 - IRG/WP 03-40265
Reinforcement of structural wood components with Fiber Reinforced Polymer (FRP) will enhance the beam’s strength, but actual data on long-term durability is sparse, not well documented or not readily accessible. In this study, bond properties of FRP-wood composite materials were investigated following treatment with creosote or copper naphthenate preservatives. The properties investigated inclu...
B Herzog, B Goodell, R Lopez-Anido


Influence addition of boron compounds to adhesives on the bonding quality and fungicidal properties of glued wood
2010 - IRG/WP 10-40497
Wood is one of the most important construction materials. However, users of wood face two issues: limited dimensions and insufficient durability. These issues have been overcome with the development of bonding and wood preservation. The preservation of glued wood is elucidated in this paper. Through the addition of boric acid to adhesives, we tried to improve the fungicidal properties of glued woo...
M Humar, B Lesar, A Ugovsek, M Kariz, P Kralj, M Šernek